High-quality 2-Layer Customized PCBAs Specialized for Connectors
Basic Info
| Model No. | PCBA-A48 |
| Assembly method | Post Welding |
| Transport package | Anti-static Packaging |
| Certification | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Definitions | IPC Class2 |
| Minimum Space/Line | 0.075mm/3mil |
| Application | Signal transmission |
| Origin | Made in China |
| Production Capacity | 720,000 M2/Year |
Product Description
PCBA Capabilities
| 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0201 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
Capability - SMT
|
Lines |
9(5 Yamaha,4KME) |
|
Capacity |
52 million placements per month |
|
Max Board Size |
457*356mm.(18”X14”) |
|
Min Component size |
0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
|
Speed |
0.15 sec/chip,0.7 sec/QFP |
Capability - PTH
|
Lines |
2 |
|
Max board width |
400 mm |
|
Type |
Dual wave |
|
Pbs status |
Lead-free line support |
|
Max temp |
399 degree C |
|
Spray flux |
add-on |
|
Pre-heat |
3 |
Q/T Lead Time
| Category | Quickest Lead Time | Normal Lead Time |
| Double-sided | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
Quality Control
| AOI Testing | Checks for solder pasteChecks for components down to 0201
Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test | Advanced Function TestFlash Device Programming
Functional testing |
- IOC incoming inspection
- SPI solder paste inspection
- Online AOI inspection
- SMT first article inspection
- External assessment
- X-RAY-welding inspection
- BGA device rework
- QA inspection
- Anti-static warehousing and shipment
FAQ
A:
Bill of materials (BOM) detailing:
a), Manufacturers parts numbers,
b), Components suppliers' parts number (e.g. Digi-key, Mouser, RS )
c), PCBA sample photos if possible.
d), Quantity
A: Free samples depend on your order quantity.
A:
No, we can't accpet picture files, if you no not have gerber file, can you send us sample to copy it.
PCB&PCBA Copy Process：